ISP co-processor

2025/09/18 18:35:41 2

协同芯片(Companion chips):AI的明智选择?-电子工程专辑

I. Rationale for ISP Collaborative Chips in Modern Imaging Systems

As smart devices, drones, security monitoring systems, in-vehicle systems, and AR/VR devices flourished, the traditional single-layer ISP chips became a bottleneck due to:

  • Limited performance in processing high-resolution multi-stream images
  • Challenges in maintaining power efficiency
  • Inability to handle real-time rendering in high-complexity environments

The disruptive ISP Collaborative Chip architecture breaks these constraints with:

  • Multi-camera/multitasking processing capabilities
  • AI-powered intelligence
  • Ground-breaking power efficiency

II. Technical Field of the Invention

This invention relates to ISP Trellis chips with revolutionary features:

Revolutionary Architecture & Parallel Processing

  • Feedback multiprocessor system enabling hardware-level task division
  • True parallel computation where:
  • Dedicated ISP cores process primary camera data
  • Secondary/wide-angle cameras use independent processing units
  • AI acceleration blocks integrate with imaging pipelines
  • 2-3× higher processing throughput vs traditional ISPs
  • 40-60% power reduction in multi-camera setups

Cutting-Edge Imaging Capabilities

Beyond standard noise reduction and color enhancement, these chips enable:

  • Frame-level synchronization of multi-stream video
  • Temporal noise reduction via multi-frame analysis
  • Dynamic HDR adapting to scene requirements
  • Neural network-based scene understanding for:
  • Automatic parameter optimization
  • Subject tracking
  • Environment-aware processing

Advanced Implementation Features

  • Heterogeneous cores (DSP+GPU+NPU) for optimized workload distribution
  • High-bandwidth memory interfaces (LPDDR5X/HBM3)
  • Scalable interconnects supporting:
  • Additional processing modules
  • Future algorithm upgrades
  • Multi-chip expansion

III. Market Applications & Future Development

Transformative Applications

Smartphone Imaging Systems:

  • Seamless integration of primary/telephoto/wide-angle/depth cameras
  • Powers computational photography features like:
  • Night mode
  • Portrait lighting
  • Super-resolution zoom

Security & Surveillance:

  • Processes multiple high-resolution streams simultaneously
  • Supports AI analytics (face detection, motion detection)
  • 24/7 low-power operation

Automotive & Drone Systems:

  • Enables 360° panorama monitoring
  • Real-time obstacle mapping
  • Advanced driver assistance features

Emerging Market Opportunities

Addresses critical needs in:

  • Industrial machine vision
  • Medical imaging devices
  • Next-gen AR/VR systems
  • Projected to capture >30% of premium ISP market by 2027

Future Evolution

  1. AI Integration:
  • On-chip neural processors
  • Self-learning algorithms
  1. Process Advancements:
  • 3nm node implementation
  • 3D chip stacking
  1. System Innovation:
  • Photonic interconnects
  • In-memory computing

CONCLUSION

ISP cooperative chips represent a quantum leap by:

✔ Breaking single-chip processing bottlenecks

✔ Enabling true multi-sensor intelligence

✔ Delivering unprecedented performance-per-watt

As demand grows for computational photography and machine vision, these architectures will become foundational across consumer and industrial imaging systems.

This version:

  1. Bolds all key technical terms, metrics, and benefits
  2. Maintains clear section hierarchy
  3. Preserves technical depth while improving readability
  4. Uses consistent formatting for features and advantages


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