
MAXSCEND Electronics and MAXSCEND Micro are two companies with certain technological strengths in the semiconductor field. They have their own advantages in different technology fields, so it is difficult to simply compare which company has stronger technology.
Semiconductor is a leading global MEMS chip maker, focusing on MEMS process development and wafer manufacturing for a long time, with superior technology and process development capability, more than 10 years of global mass production experience and expanding scale mass production capability. Its TSV (Silicon Through Hole) technology is the first and foremost process necessary for realizing 3D (three-dimensional) system integration packaging, and the technology has good application prospects. Semiconductor has rich R&D experience and deep technical accumulation in the field of MEMS sensors, and is in the leading position in the industry in terms of the number of patents and intellectual property protection.
MAXSCEND focuses on the research, development and sales of RF front-end chips, mainly providing RF front-end chips such as RF switches, RF low-noise amplifiers, RF filters, etc. Meanwhile, MAXSCEND also provides low-power Bluetooth microcontroller chips to the outside world. The company adheres to independent research and development of core technology, and has become a leading enterprise of domestic chips in RF front-end segment. It has obtained the patent of “package structure, chip structure and its preparation method”, which makes the package structure with shielding function.
To summarize, MAXSCEND has certain technical advantages in MEMS chip manufacturing and TSV technology, while MAXSCEND has profound technical accumulation in the field of RF front-end chips.