Winbond's way to optimize signaling efficiency in storage devices

Winbond mainly optimizes the signal transfer efficiency of the storage device through the following ways:

Optimizing circuit design:

• Enhancing the signal driving ability: Adopting special transistor structure or increasing the number of driving transistors to improve the driving ability of the word line driving unit on the word line to ensure that the word line can be activated quickly and accurately to realize high-speed reading and writing of data, reduce the errors caused by insufficient signal strength or unstable signal transmission, and then enhance the signal transmission efficiency of the whole storage system.
• Adoption of layered decoding structure: Reduces signal transmission delay, determines the storage unit to be accessed faster, and accelerates the speed of reading and writing data, thus improving the overall performance and signal transmission efficiency of the storage system.

Application of advanced processes and materials :

• Advanced Semiconductor Manufacturing Processes: Utilizing smaller transistor sizes and higher integration processes, more logic circuits and storage units are integrated on the same chip, reducing the chip area while reducing the probability of defects introduced by the manufacturing process, improving the yield rate of the chip, which in turn improves the reliability and signaling efficiency of the system.
• New semiconductor materials: Explore and apply new semiconductor materials, such as silicon carbide, gallium nitride, etc. These materials have higher electron mobility and better thermal stability, which can further improve the performance and efficiency of the decoder circuit, and better thermal stability means that the circuit's performance is more stable and reliable at different temperatures, which reduces performance fluctuations and the possibility of failures due to temperature variations, thus improving the The storage system's signaling efficiency and stability in various environments.

Enhanced power management :

• Silicon Capacitor Application: Providing silicon capacitors in its CUBE chips reduces the impact of power supply fluctuations. When the core voltage of the advanced process SOC is low and the power supply fluctuates during operation, silicon capacitors can help the SOC obtain a stable voltage, thus ensuring signal stability and indirectly improving signal transmission efficiency.

Architecture innovation and packaging technology:

• 3D Stacking Architecture: For example, CUBE adopts 3D stacking technology combined with heterogeneous bonding technology, as well as the 3D stacking architecture of kgd 2.0, which not only improves the storage density, but also shortens the signaling path, enhances the signal integrity, and improves the signaling efficiency, while providing the performance advantages of high bandwidth and low power consumption.
• 2.5D/3D Packaging Technology: Winbond's Chip-on-Wafer (CoW), Wafer-on-Wafer (WoW), and back-end 2.5D/3D Chip-on-Si-Interposer's substrate and fan-out solutions, etc., optimize the connection between the chips to reduce the signal transmission loss, improve signal transmission efficiency and overall performance.